Wave Soldering Process, Defects and Diagram

Learn in Detail about Wave Soldering Process, Defects and Diagram.

Here we will Learn about Wave Soldering Process, Defects and Diagram.

A Wave Soldering Machine

Wave Soldering Process

Wave soldering process is used for mass soldering of through-hole Electronic Components to the PCB. Waves of Molten Solder is used in the Process, hence the name wave soldering.

The Process starts once all the through-hole components are placed onto the PCB that moves across on a conveyor belt.

Following are the Steps Involved in the Process:

Step-1: Fluxing

Flux is sprayed to the PCB to clean the leads of the components and the copper tracks on the PCB. Fluxing removes any oxide that may have deposited on component leads and the PCB Copper Track. This flux can be RA (Rosin Activated), RMA (Rosin Mildly Activated), Water Soluble Flux or No-Clean Flux.

Step-2: Preheating

After the Fluxing Zone, the conveyor belt moves to the preheating zone. Here the Board is Preheated to avoid any thermal shock when the Board moves to the Very High Temperature of the Molten Solder Wave.

Step-3: Wave Solder

The Conveyor then moves to the Pan where Solder Waves are formed using a Pump. The Board moves over the Wave and the Lead of the Electronic Components gets Soldered to the PCB.

Step-4: Cleaning

This step depends on the Type of Flux used during Fluxing. No-Clean Flux from Alpha Cookson do not require any cleaning. However, other types of fluxes need cleaning of the PCBA (Printed Circuit Board Assembly) with solvents and deionized water to remove flux residue

Step-5: Final Stage

Finally the PCBA undergoes quality test. It is Marked “Passed” or “OK” or “Failed“.

Failed PCBAs then goes for Rework / Repairing.

Video: Wave Soldering Process

Wave Soldering Defects

Pin hole or blow hole defects are major problem during wave soldering.

Both these defects are generally associated with thickness of copper plating. Moisture in the board escapes through either thin copper plating or voids in the plating and forms Pin Hole or Blow Hole Defects.

Wave Soldering Defects: Pin hole and Blow hole

Diagram: Wave Soldering Vs Reflow

Diagram: Wave Soldering Vs Reflow PCB Assembly Process

FAQs: What is Wave Soldering?

In wave soldering, the PCB is passed over a bath of molten solder. A pump generates a controlled wave of solder, and the PCB is positioned so that the components' leads or pins pass through the wave. The solder adheres to the exposed metal surfaces, forming reliable connections. Preheating and flux application are essential to ensure proper wetting and prevent defects.

Wave soldering offers several advantages, including:

  1. Speed and Efficiency: It enables simultaneous soldering of multiple connections, making it faster than manual soldering.
  2. Consistency: Provides uniform solder joints across a batch of PCBs, reducing variability and defects.
  3. Suitability for Through-Hole Components: Ideal for through-hole components that cannot be surface-mounted.
  4. Cost-Effectiveness: Reduces labor costs and is well-suited for high-volume production.
  5. Reliability: Produces strong, robust connections with good mechanical strength.

Flux is a crucial element in wave soldering. It serves several purposes:

  1. Flux Cleansing: It removes oxides and contaminants from metal surfaces, ensuring good solder wetting.
  2. Prevention of Oxidation: Flux prevents oxidation of metal surfaces during the soldering process.
  3. Improving Wetting: Flux promotes the formation of strong and reliable solder joints by enhancing solder flow and wetting characteristics.

Several factors influence wave soldering quality, including:

  1. Temperature: Proper preheating and solder bath temperature are crucial for optimal solder flow and wetting.
  2. Flux Application: Accurate and consistent flux application ensures proper cleaning and wetting.
  3. PCB Design: Adequate spacing between components, appropriate pad design, and avoiding excessive copper exposure improve soldering results.
  4. Component Orientation: Correct component orientation prevents shadowing and ensures uniform heating and soldering.
  5. Solder Alloy: Choosing the right solder alloy with suitable properties is essential for strong and reliable connections.

Related Posts:

Please SHARE:

Santosh Das

Santosh, founder of this Electronics Tutorial Website, is an Electronics Geek, Blogger and Young Entrepreneur. He possesses vast experience in the field of electronics, electronic components, PCB, Soldering, SMT, Telecommunication, ESD Safety, and PCB Assembly Tools, Equipment and Consumables. Keep visiting for daily dose of Tips and Tutorials.

Also Read:

5 Responses

  1. July 28, 2019

    […] Wave Soldering Process, Defects and Diagram […]

  2. August 4, 2019

    […] Bar – For Wave Soldering and Pot or Dip […]

  3. August 4, 2019

    […] Wave Soldering Process, Defects and Diagram […]

  4. September 22, 2019

    […] Wave Soldering Process, Defects and Diagram […]

  5. December 27, 2019

    […] Wave Soldering Process, Defects and Diagram […]

Leave a Reply

Your email address will not be published. Required fields are marked *

Discover more from Electronics Tutorial | Best Electronics Tutorial Website

Subscribe now to keep reading and get access to the full archive.

Continue reading