Surface Mount Technology (SMT): In-depth tutorial on SMT by SMT Expert and SMT Solver including: What is Surface Mount Technology (SMT), Benefits and uses of SMT, Types of Surface Mounting in SMT, SMT Acronym, Abbreviation and Dictionary, SMT Equipment (Pick-and-Place Machine for SMT, Wave Soldering Equipment & Process, Reflow Soldering Equipment for SMT,  Solder Paste Screen Printer for SMT, Curing / Baking Oven for SMT, Solvent Cleaning in SMT, Repair and Inspection Equipment for SMT), SMD: Surface Mount Electronic Components for SMT and more.

Surface Mount Technology (SMT) is a packaging technology that mounts SMD (Surface Mount Devices / Surface Mount Component) components on the surface of a Printed Circuit Board / Printed Wiring Board (PCB / PWB) instead of inserting them through holes of the board. SMT is comparatively a new technology in electronics and provides state-of-art, small and miniature electronics products and gadgets.

History of SMT (Surface Mount Technology) dates back to 1950s and 1960s when Flat Packs (FP) and hybrids were used. Today, SMT is continually evolving and developing. Currently the use of SMD Components includes Fine Pitch, Ultra Fine Pitch (UFP) and Ball Grid Arrays (BGAs). Next level of packaging technologies such as Chip-on-Board (COB), Tape-Automated Bonding (TAB), and Flip Chip Technologies are also gaining widespread acceptance and use.