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Ball Grid Array (BGA) Package

Santosh Das

Santosh Das

Santosh, founder of this Electronics Tutorial Website, is an Electronics Geek, Blogger and Young Entrepreneur. He possesses vast experience in the field of electronics, electronic components, PCB, Soldering, SMT, Telecommunication, ESD Safety, and PCB Assembly Tools, Equipment and Consumables. Keep visiting for daily dose of Tips and Tutorials.

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20 Responses

  1. November 12, 2014

    […] the Guide Plate on the base, and hold the BGA with the vacuum […]

  2. February 28, 2019

    […] own SMT consulting service in 1994. He helps companies in successful implementation of SMT, RoHS, BGA and BTC (QFN, DFN and […]

  3. March 11, 2019

    […] Soldering material may include solder in the form of solder wire, solder paste, solder balls for BGA (Ball Grid Array) and soldering […]

  4. March 15, 2019

    […] Ball Grid Array (BGA) Package […]

  5. March 16, 2019

    […] BGA or Ball Grid Array is an array package like PGA (pin grid array) but without the leads. […]

  6. March 17, 2019

    […] are actually ‘mounted’ or affixed on the surface of the SMT printed circuit board). A BGA package has no leads or pins. The Ball Grid Array gets its name because it is basically an array of metal […]

  7. March 20, 2019

    […] if large fine pitch, ultra fine pitch, QFP (Quad Flat Pack), TCP (Tape Carrier Package), or BGAs (Ball Grid Arrays) and very small chip components (0603 or 0402 or smaller) are used on these assemblies along with […]

  8. March 20, 2019

    […] do not experience problems related to CTE mismatch. The large plastic packages, especially plastic ball grid arrays (PBGA), may be prone to cracking at reflow soldering temperatures, however, and this is an industry […]

  9. April 7, 2019

    […] of BGA […]

  10. April 7, 2019

    […] Ball Grid Array (BGA) Package […]

  11. April 7, 2019

    […] soldering can be done using a soldering iron and solder wire or using solder paste or solder balls (BGA) and SMD Hot Air Blower / rework […]

  12. April 23, 2019

    […] BGA or Ball Grid Array are small tiny electronic components without any leads. They have tiny ball underneath the IC. These ICs or BGAs are soldering so the PCB using Automated BGA Soldering Machine or Hot air Reflow Machine. Visit – SMT Expert – Ray Prasad […]

  13. June 30, 2019

    […] Ball Grid Array (BGA) Package […]

  14. August 3, 2019

    […] Ball Grid Array (BGA) Package […]

  15. August 6, 2019

    […] form of electronic components are BGA or Ball Grid Array. They are special components and need special soldering. They do not have any leads coming out , […]

  16. August 9, 2019

    […] Solder Balls for BGA […]

  17. September 11, 2019

    […] Rework / Modification / BGA Package […]

  18. September 22, 2019

    […] materials including solder wire, solder paste, solder bar, solder balls for BGA, solder preforms (depending on the type of soldering to be […]

  19. September 22, 2019

    […] are other challenges such as – Routing, Constraints, High Pin Count of BGA Package and Very Fine Pitch SMD Components, Signal Integrity […]

  20. December 5, 2019

    […] Coplanarity: The maximum distance between the lowest and the highest pin when the package rests on a perfectly flat surface. 0.004 inch maximum Coplanarity is acceptable for peripheral packages and 0.008 inch maximum for BGA Package. […]

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