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SMT Vs Through Hole Technology – Advantages and Disadvantages

SMT Vs Through Hole Technology – Advantages / Benefits and Disadvantages of SMT over Through Hole Technology in Terms of Cost, Assembly, Soldering.

SMT Vs Through Hole Technology – Which is better in terms of Cost, Assembly and Reliability? This debate has been ON for several years now.

The benefits of SMT or Surface Mount Technology over Through Hole Technology are available in both design and manufacturing. Surface Mount Components or SMD Components are small and can be mounted on either side of the SMT PCB and have gained widespread usage by electronic companies.

Let us discuss the advantages and disadvantages of SMT Vs Through Hole Technology in some detail.

SMT Vs Through Hole

SMT Vs Through Hole

SMT Vs Through Hole – Advantages of Surface Mount Technology

Among the most important design-related benefits or advantages are significant savings in weight and real estate (Size of the PCB) and electrical noise reduction. A SMD Component can weigh as little as one-tenth of their conventional through-hole / thru hole electronic components. This causes a significant reduction in weight of the Surface Mount Assembly (SMA). Because of their smaller size, surface mount components occupy only about one-half to one-third of the space on Different Types of PCB. This leads to smaller and slimmer mobile phone, tablets, laptops and other such gadgets.

SMT also provides improved shock and vibration resistance as a result of the lower mass of SMD components. Shorter lead lengths of Surface Mount Components offer benefits of lower parasitic that reduces propagation delays and reduces package noise.

Manufacturing Benefits of Surface Mount Technology over Through Hole Technology

In addition to design benefits, SMT also provides many manufacturing benefits to PCB Manufacturing Companies. These benefits include reduced PCB Material Cost, reduced material handling cost, and a controlled manufacturing process.

Routing of traces is reduced, size of the board is reduced, and number of drilled holes is also reduced. A smaller board with fewer drilled holes will naturally cost less.

If the functions of the surface mount board are not increased, the increased inter-package spacing made possible by smaller surface mount components and a reduction in the number of drilled holes may also reduce the number of layer counts in the printed circuit board. This will again lower the board cost.

SMT PCB Assembly Process

SMT Vs Through Hole – Disadvantages of SMT over Through Hole

Since all basic electronic components are not available in surface mount, the actual area savings on a board will depend on the percentage of through-hole components replaced by surface mount components. Depending on the component mix, the three types of surface mounting provide different levels of benefits.

Conclusion

The above benefits of Surface Mount Technology don’t necessarily means that SMT assembly will always cost less. It depends when and how SMT is used.

FAQs: Through-Hole Vs SMT

Through-Hole Technology is an electronic assembly method where components are inserted into holes drilled in a PCB. The components have leads that pass through the holes, and they are then soldered on the opposite side of the board to make connections.

  1. Size and Space Efficiency: SMT components are smaller, allowing for higher component density and smaller PCBs.
  2. Faster Assembly: SMT components can be placed and soldered quickly using automated machines, reducing assembly time.
  3. Higher Frequencies: SMT's compact design reduces parasitic effects, making it suitable for high-frequency applications.
  4. Cost-Effective: SMT components are often cheaper to produce due to their smaller size and automated assembly processes.
  5. Better Thermal Performance: SMT components' smaller size improves heat dissipation and thermal management.

  1. Complex Rework: SMT components can be challenging to repair or replace, especially for hand soldering or rework.
  2. Durability: SMT solder joints might be more susceptible to mechanical stress and vibration compared to through-hole solder joints.
  3. Limited Current Handling: Through-hole components can handle higher currents due to larger lead sizes and stronger connections.
  4. Testing Challenges: SMT components can be harder to test individually due to their small size and closely packed arrangement.
  5. Component Availability: Some specialized or high-power components might still be primarily available in through-hole packages.

  • Choose SMT When: You need compact designs, faster assembly, higher-frequency applications, and cost-effective production.
  • Choose Through-Hole When: You require higher current handling, mechanical durability, easier repair/replacement, and certain specialized components not available in SMT packages.

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Santosh Das

Santosh, founder of this Electronics Tutorial Website, is an Electronics Geek, Blogger and Young Entrepreneur. He possesses vast experience in the field of electronics, electronic components, PCB, Soldering, SMT, Telecommunication, ESD Safety, and PCB Assembly Tools, Equipment and Consumables. Keep visiting for daily dose of Tips and Tutorials.

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22 Responses

  1. Raju adhikari says:

    nice article about SMT keep it up.

  2. Kasdon says:

    This is a very good article explaining through-hole and surface mount technology. I’ve seen the terms ‘SMA’, ‘SMD’, and ‘SMT’ quite a lot around the internet and I was wondering if they are referring to the same thing?

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