Ball Grid Array (BGA) Package – Types of BGA, Advantages, Disadvantages and Soldering of Ball Grid Array, Pin Grid Array, Land Grid Array.
SMT Troubleshooting will always be there. SMT is NOT ZERO-Defect soldering process. Problems will Occur, but Solutions are there.
SMT Repair and Inspection Equipment are unique to Surface Mount Technology.
SMT Baking Oven or SMT Curing Oven is used for SMD Soldering in Surface Mount Technology (SMT).
SMT reflow soldering equipment / machine is the second major equipment after pick-and-place machine in any SMT line.
SMT Solvent Cleaning Equipment / Machine are used in Electronics to clean and remove excess solder from electronic assemblies (PCB) after soldering.
Solder Paste Screen Printer for SMT is needed to screen print solder paste onto the printed circuit board (PCB) before placement of surface mount components (SMD) for Reflow Soldering.
This SMT Dictionary or Surface Mount Technology Dictionary Explains Meanings of Terms used in SMT – Acronym and Abbreviation.
Surface Mount Design issues, CTE Mismatch Problem and Land Pattern Standard must be settled before a surface mount technology design or packaging direction is selected.
There are 3 Types of Surface Mounting in SMT – Type I, Type II and Type III. They use mix of SMD and Through Hole Components and Soldering Techniques. Let us discuss them and understand in detail.
- SMT Soldering Process and techniques is little different from through hole technology.
For successful SMT Manufacturing Line and and Assembly Process and implementation of Surface Mount Technology (SMT)