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Surface Mount Design Considerations in SMT & CTE Mismatching

Santosh Das

Santosh Das is an Electronics Engineer, Blogger, Young Entrepreneur and Founder of this Electronics Tutorial Website. Santosh possesses vast experience in the field of electronics, telecommunication, Soldering, SMT, ESD Safety, and electronics manufacturing tools, equipment and consumables. Santosh left his job in 2014 and started his own Private Limited Company that deals and supplies PCB Assembly and Rework Tools, Equipment and Consumables. Keep visiting for daily dose of Tips and Tutorials.

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4 Responses

  1. November 28, 2013

    […] Surface Mount Design Considerations in SMT & CTE Mismatching […]

  2. March 5, 2019

    […] Surface Mount Design Considerations in SMT & CTE Mismatching […]

  3. March 16, 2019

    […] where hermiticity is not required. The ceramic packages have solder joint cracking due to CTE mismatch between the package and the substrate, but the plastic packages are also not trouble […]

  4. March 20, 2019

    […] CTE (Coefficient of Thermal Expansion): The ratio of the change in dimensions to a unit change in temperature. CTE is commonly expressed in ppm/ degree Celsius. […]

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