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Surface Mount Design Considerations in SMT & CTE Mismatching

Santosh Das

Santosh Das

Santosh, founder of this Electronics Tutorial Website, is an Electronics Geek, Blogger and Young Entrepreneur. He possesses vast experience in the field of electronics, electronic components, PCB, Soldering, SMT, Telecommunication, ESD Safety, and PCB Assembly Tools, Equipment and Consumables. Keep visiting for daily dose of Tips and Tutorials.

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6 Responses

  1. November 28, 2013

    […] Surface Mount Design Considerations in SMT & CTE Mismatching […]

  2. March 5, 2019

    […] Surface Mount Design Considerations in SMT & CTE Mismatching […]

  3. March 16, 2019

    […] where hermiticity is not required. The ceramic packages have solder joint cracking due to CTE mismatch between the package and the substrate, but the plastic packages are also not trouble […]

  4. March 20, 2019

    […] CTE (Coefficient of Thermal Expansion): The ratio of the change in dimensions to a unit change in temperature. CTE is commonly expressed in ppm/ degree Celsius. […]

  5. March 25, 2019

    […] and acceptable impedance. Other points to keep in mind with printed circuit board design are CTE, cost and dielectric properties. The designer needs to carefully balance the constraints of cost […]

  6. August 16, 2019

    […] Surface Mount Design Considerations in SMT & CTE Mismatching […]

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