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SMD Soldering | Surface Mount Soldering Guide

Learn How to Solder SMD in this Detailed Surface Mount Soldering Guide.

SMD Soldering and Desoldering is little different from thru-hole Soldering and Desoldering Process.

SMD Desoldering is generally done using a Hot Air Blower while Soldering can be done using a soldering iron and solder wire or using solder paste or solder balls (BGA) and SMD Hot Air Blower / rework station.

There are many process for surface mount soldering for SMD Components but none is perfect for all applications.

SMD Soldering

Types of SMD Soldering Process

All SMD soldering processes have technical concerns and there are ways to resolve those concerns. Because it offers higher yield and lower operation cost, convection dominant IR soldering has evolved as the preferred process for reflow soldering.

Vapor phase soldering will not disappear but will continue to be used in niche applications. For some specialized jobs, other reflow soldering processes such as laser and hot bar resistance soldering are also used.

These soldering processes are intended not to replace either vapor phase or IR but to complement them. The process ultimately used should be selected on the basis of the specific requirements of the intended application, the solder defect results, and the overall cost.

SMD Soldering Process for Mass Production

For Mass Production in Factories, SMD Soldering is Done using SMT Machine. The Main such Machine is the Reflow Oven.

Reflow Oven Machine

Reflow Oven Machine

The most widely used reflow soldering processes in electronics are:

  1. Vapor Phase; and
  2. Infrared.

Read:

Video: Selective Soldering Process

Manual SMD Soldering Process

Manual SMD Soldering is Done using a Soldering Iron or Soldering Station, Hot Air SMD Rework Station, Solder Wire and Solder Paste. This process is used mainly for Repairing / Rework.

Read: SMT Soldering and PCB Assembly

Video: SMD Soldering Guide – How to Solder SMD Components

Selection of Soldering Process

Since the electronics industry will remain in a mixed pcb assembly mode, use of SMD Electronic Components and Through-Hole Electronic Components to assemble Different Types of PCB, the use of through-hole components will continue for the foreseeable future. There is no process more cost effective than wave soldering for through-hole active and passive electronic components. The use of reflow with solder paste will also be preferred for some application.

Because of the widespread use of low solids or no-clean solder flux, the use of nitrogen has become common for both wave soldering and reflow soldering processes. However, one should not expect nitrogen to be a panacea for solder defects. It will help only to the extent of its influence on soldering yield. Nitrogen is not going to solve issues related to other parameters such as design, flux activity, solder paste, print quality, and solder profile etc.

The selection of a soldering process depends on the mix of electronic components to be soldered. Various soldering processes will complement each other instead of replacing them. Even hand soldering is not going to disappear entirely.

SMT PCB Assembly Process

PCB Assembly Process Flow Chart (PCBA Process)

PCB Assembly Process Flow Chart (PCBA Process)

PCB Assembly Process Flow Chart (PCBA Process)

FAQs: Surface Mount Soldering

Automated SMD Soldering is done using Surface Mount Technology (SMT. Reflow Oven and Pick-and-Place Machine are two major machines needed in the process.

For manual SMD soldering, you will need a soldering iron with a fine tip (25-30W), fine soldering wire (0.5mm or smaller), flux (liquid or paste), tweezers, a magnifying glass or microscope, and a clean, well-lit workspace.

Solder bridges occur when solder unintentionally connects adjacent pads. To prevent this, use a minimal amount of solder, apply flux to the pads, and use solder wick or a desoldering pump to remove excess solder. Fine-tipped tweezers can help position components accurately.

Reflow soldering involves placing components on a PCB, then heating the entire assembly to melt solder and create connections. Hand soldering requires manually placing components, applying solder, and heating each joint. Reflow is more suitable for mass production, while hand soldering is common for prototypes or low-volume work and rework.

Practice is the key. Ensure your soldering iron is at the right temperature (not too hot), use the right amount of flux, and avoid excessive heat exposure to prevent damage. Clean the soldering tip regularly, and practice component placement and soldering on scrap PCBs before working on critical projects.

Related Posts:

Santosh Das

Santosh, founder of this Electronics Tutorial Website, is an Electronics Geek, Blogger and Young Entrepreneur. He possesses vast experience in the field of electronics, electronic components, PCB, Soldering, SMT, Telecommunication, ESD Safety, and PCB Assembly Tools, Equipment and Consumables. Keep visiting for daily dose of Tips and Tutorials.

Also Read:

30 Responses

  1. Adedeji Adeloro says:

    I am absolutely grateful for the great work Engineer Santosh is doing in generously sharing his knowledge of electronic engineering with such a wide audience. I encourage him to, please, not tire out. There are many beneficiaries of his work out here. And i must say, I am one of them!

  2. Confy Scenty says:

    Seconded. I really love his tutorials too.

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