Tag Archives: bga

Ball Grid Array (BGA) Package

Ball Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a laminated substrate at the bottom of the package. The die of the BGA is connected to the substrate by wire bonding or flip-chip technology. The …

BGA (Ball Grid Array): Repairing and Soldering BGA

Electronic Devices and Gadgets are getting smaller and slimmer day by day. All this is possible because of technological progress and development in electronics. Top Electronic Companies in the World are in competition to make the smallest and slimmest gadgets. SMDs or Surface Mount Devices and BGA or Ball Grid array are two electronic components responsible for making electronic devises …