Tag Archives: SMD Soldering

SMT Curing / Baking Oven for SMT Soldering

There are three types of Surface Mounting: Type 1, Type II and Type III.

For Type III surface mount, components glued to the bottom of the board require curing before wave soldering. In addition, electronic components placed on the solder paste in Type I and Type II Surface Mount Technology assemblies achieve reduced solder defects (such as solder balls) by …

Surface Mount Soldering Guide – SMD Soldering

There are many soldering process available for surface mount components but none is perfect for all applications. All SMD soldering processes have technical concerns and there are ways to resolve those concerns. Because it offers higher yield and lower operation cost, convection dominant IR soldering has evolved as the preferred process for reflow soldering.

Vapor phase soldering will not disappear …