Tag Archives: SMT Soldering

SMT Curing / Baking Oven for SMT Soldering

There are three types of Surface Mounting: Type 1, Type II and Type III.

For Type III surface mount, components glued to the bottom of the board require curing before wave soldering. In addition, electronic components placed on the solder paste in Type I and Type II Surface Mount Technology assemblies achieve reduced solder defects (such as solder balls) by …

SMT Soldering and PCB Assembly Techniques

In Electronics, SMD soldering and SMT Assembly Techniques are different from that of thru-hole soldering techniques. SMD soldering or Surface Mount Technology assembly needs different SMT Equipments and greater experience and expertise.

Surface Mount Circuit Boards have flat tin-lead or gold-plated copper pads without any hole. These traces are called solder pads. Semi-solid solder called solder paste consisting of very …