Tag Archives: what is bga

Ball Grid Array (BGA) Package

Ball Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a laminated substrate at the bottom of the package. The die of the BGA is connected to the substrate by wire bonding or flip-chip technology. The BGA substrate has internal conductive …